PRODUCTS
Product description
Product Features
1). Utilizing a picosecond laser, ultra-short pulse processing achieves non-thermal conduction, suitable for high-speed cutting and drilling of glass, with burrs and heat-affected zones within 30μm;
2). It supports integrated cutting and splitting or standalone cutting and splitting machine;
3).Featuring CCD visual pre-scanning & automatic target capture positioning;
4).Marble platform, stable load-bearing, corrosion-resistant, moisture-proof and rust-proof;
5).It can meet the cutting requirements of different shapes of special-shaped glass with different thickness and glass with inner holes more than 100mm.
